Gold Member Since 2011
Audited Supplier
Zhangjiagang Oriental Construction Material Co., Ltd.

Prefabricated House Sandwich Panel, PU Cold Sandwich Panels, Innovation Construction manufacturer / supplier in China, offering Temporary Housing Economical EPS Sandwich Panel, Decorative Wood Panel Fiberglass Board, CE Magnesium Oxide Board CE MGO Board and so on.

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Supplier Homepage Product Sandwich Panel Mgo Sandwich Panel Temporary Housing Economical EPS Sandwich Panel

Temporary Housing Economical EPS Sandwich Panel

Purchase Qty.:
(PCS)
100-499 500+
FOB Unit Price: US $25 US $95
Purchase Qty. (PCS) FOB Unit Price
100-499 US $25
500+ US $95
Get Latest Price
Production Capacity: 10, 000PCS/Day
Transport Package: Export Standard Wooden Pallets
Payment Terms: L/C, T/T, Western Union

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Basic Info
  • Model NO.: 4′X8′
  • Color: White
  • Edge: Tongue & Groove, Camlock.Two or Four Sides Closed
  • Inner Treatment: EPS, XPS, PU, PIR
  • Delievery: 20 Days
  • Sample: for Free
  • Material: MGO+EPS/XPS+MGO
  • Trademark: OCM OEM acceptable
  • Origin: Zhangjiagang, China
  • Customized: Customized
  • Density: EPS:18-20kg/M3 XPS:36-40kg/M3
  • Surface Treatment: MGO Board
  • Fire Resistant Time: More Than 3 Hours
  • Certificate: ISO9001: 2000
  • Quality: Grade a
  • Usage: Warehouse, Villa
  • Specification: as Customer′s Request
  • HS Code: 68080000
Product Description
Structural insulated panel, also called MGO SIP and MGO sandwich board. It consists of a sandwich of two layers of structural board with an insulation foam in between. Panel skins are magnesium oxide boards. Insulation core can be expanded polystyrene(EPS) and extruded polystyrene(XPS) and so on. These are structural sheaths that can be finished like drywall on the interior, and covered with siding materials or have stucco applied directly to the exterior of the panel. When the panel is used for basement or foundation walls, foundation spray can be applied directly to the surface.


Advantages

Fast construction, with less reliance on highly skilled trades.

Eliminates framing, insulating, vapour barrier installation and wall cribbing.

Energy efficient - up to 40% heat loss reduction vs stick built. Significant heating and cooling savings. Less temperature fluctuation, less drafty, provides an excellent sound barrier creating a more comfortable living environment.

Superior structural strength to stick built. Performs better under extreme weather conditions - earthquakes, hurricanes, etc. Less material waste and handling. Superior wall strength. No nail pops. Cabinetry and pictures easier to hang.

Interior and exterior walls can be finished without additional sheathing - eliminates costly steps and additional materials. Available with wood and grain outside wall finish.

Applications:

The flexibility of our building system is ideal for many applications including residential, industrial shops and warehouses, ready to move buildings and trailers, hotels, factories, aircraft hangars and apartments.

Specification

1. MGO board thickness: 3-20mm
2. EPS core thickness: 15-250mm
3. XPS core thickness: 15-120mm
4. Max width: 1220mm; Max length: 3660mm
Standard size 1200*2400mm, 1200*2700mm, 1200*3000mm.
5. Connection can be Tongue & Groove, Camlock, two or four sides closed.



OCM have design and technical department can design SIP special for you. Just let us know you ideal and we can do the rest.

>>Please contact eith OCM salse for get connection solution.

 
Technical date forEPS foam board

Density

 

Kg/m 3

18-20

Thermal conductivity, 90 days, 10C

 

W/mk

≤ 0.04

Compressive strength at 10% deflection
or yield, (Vertical)

 

kPa

≥ 100

Tensile strength

kPa

≥ 100

Coefficient
of linear thermal expansion

mm/mk

≤ 0.03

Temperature
limits

 

 
-50, +75

Fire classification

B1

 

Technical data for
XPS foam board

Density

Kg/m3

36-40

Thermal conductivity, 90days, 10

W/mk

 

0.027-0.03

Compressive strength at 10% deflection or
yield, (Vertical)

kPa

 

≤ 300

Tensile strength

kPa

≤ 300

Water absorption

Vol-%

≥ 1.00% n

Capillarity

nil

nil

Coefficient of linear thermal expansion

mm/mk

0.07

Temperature limits


(-50, +75)

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Mrs. Lynn Zhang
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